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Conductive Copper Foil Tape Specifications
Our conductive copper foil tape combines flexible copper foil with electrically conductive acrylic adhesive, providing reliable conductivity through the adhesive layer. It is suitable for EMI/RFI shielding, grounding, static discharge, PCB assembly, cable wrapping, and electronic enclosure applications.
| Property | Specification |
|---|---|
| Product Type | Single-sided conductive copper foil tape |
| Copper Foil | Dead-soft electrolytic copper foil |
| Copper Foil Thickness | 25 μm ± 3 μm |
| Adhesive Type | Electrically conductive acrylic adhesive |
| Adhesive Thickness | 35 μm ± 5 μm |
| Total Tape Thickness | Approx. 60 μm, excluding release liner |
| Adhesive Conductivity | Conductive through the adhesive layer |
| Standard Width | 2–390 mm |
| Roll Length | 20 m, 25 m, 50 m or customized |
| Release Liner | Paper or PET release liner |
| Operating Temperature | -20°C to 90°C |
| Short-Term Temperature | Up to 120°C |
| Surface Finish | Natural copper |
| Solderability | Copper surface can be soldered |
| Custom Processing | Slitting, laminating, sheets, kiss cutting and die cutting |
| Typical Applications | EMI/RFI shielding, grounding, PCB repair, cable shielding and electronic assembly |
| Compliance | RoHS and REACH available upon request |
| Packaging | Standard export packaging or customized OEM packaging |
Custom foil thicknesses, adhesive systems, widths, roll lengths and die-cut shapes are available according to your application. Electrical resistance, peel adhesion and temperature test data can be provided with the technical data sheet.
Foil Copper Tape Applications
EMI/RFI seam shielding for metal and plastic enclosures; close gaps around lids, panels, and cable entry points.
Grounding straps & patching—create a return path between subassemblies or around hinges.
PCB repair & lab prototypes—temporary jumpers, shield walls, and patch fixes that test like production.
Instrumentation & test rigs—fast noise reduction without enclosure redesign.
Cavity/guitar shielding—line pick-up cavities and guards to reduce hum.
Copper Foil Adhesive Tape Features
- Copper Foil Thickness: 25µ ±3 Conductive
- Adhesive Thickness: 35µ ±5
- High temperature resistance (90-120°C)Double-sided conductive. acid/alkali/solvent resistance, strong holding power,clean removal
- EMI/RFI attenuation – Creates a continuous copper path across seams and covers, reducing radiated and conducted noise.
- Grounding continuity – With double-sided conductive adhesive, current flows through overlaps and the bondline—ideal for seams and patching.
- Formable backing – Dead-soft copper conforms to radii, screw bosses, and surface texture; can be soldered where allowed.
- Low-resistance paths – Overlaps can be designed for milliohm-level continuity when surfaces are prepped and pressure is correct.
- Flexible configurations – Choose conductive or non-conductive adhesive; liner for easy handling; anti-oxidation treatments available by grade.
- Custom formats – Slit-to-width, kiss-cut sheets, and die-cuts (tabs, washers, rings) for repeatable assembly.
Why Choose Copper Foil Tape
Double-sided conductive
adhesive + copper foil for shielding continuity.
Low resistance
(≈0.05 Ω) suitable for EMI/RFI paths.
Heat resistance
90–120 °C for typical installations.
Quality and Handling
- Storage: Cool, dry; keep rolls bagged; avoid prolonged exposure before install.
- Handling: Use gloves; avoid touching the adhesive; keep liner on until placement.
- Traceability: Retain core/pack labels; rotate stock (FIFO).
- Soldering: Remove adhesive/liner at solder point; control heat; validate adhesion after solder cools.
Copper Tape Foil Performance
| Property | Typical Values / Options |
| Backing | Dead-soft copper foil (e.g., 18–50 µm common; others on request) |
| Adhesive systems | Conductive acrylic (through-adhesive conduction) or non-conductive acrylic (mechanical hold) |
| Bondline behavior | Electrical continuity across overlaps with conductive adhesive; use hardware/primer if non-conductive |
| Resistance (across overlap) | Low milliohm potential with clean surfaces, firm pressure, and adequate overlap (design-dependent) |
| Heat tolerance | Typically 90–120 °C continuous for adhesive; copper backing tolerates higher; verify by grade |
| Shielding effectiveness | Application-dependent; improved by coverage, overlap strategy, and compression |
| Standard lengths | 20–50 m rolls typical; customs available |
| Widths | Stock metric/imperial; slit-to-width with tight tolerances |
| Formats | Rolls, kiss-cut sheets, precision die-cuts (disks, frames, washers, tabs) |
| Surface | Bare copper; optional anti-oxidation/treated surfaces (grade-dependent) |
| Solderability | Copper is solderable; confirm adhesive/liner removal and heat limits before soldering |
Important: Adhesive temperature and time at temperature govern long-term performance. For sustained high heat or aggressive environments, validate with your exact profile.
Copper Foil Conductive Tape Selection Guide
| Need / Scenario | Adhesive Type | Foil Thickness | Format | Why this works |
| Seam shielding with overlap | Conductive acrylic | 25 µm | 12–25 mm rolls | Conducts through the bondline; overlap forms a continuous path. |
| Ground patch to chassis | Conductive acrylic | 25–35 µm | Die-cut tabs + roll | Low-resistance tie-ins at screws or star washers. |
| Cable shield wrap / harness | Non-conductive (then hardware bond) or conductive | 18–25 µm | 12–18 mm rolls | Choose conductive for full wrap continuity; non-conductive if bonding mechanically. |
| Prototype fixes on PCBs | Conductive acrylic | 18–25 µm | Kiss-cut sheets | Thin foil conforms; easy peel-stick-test-revise workflow. |
| Instrument cavity/guitar | Conductive acrylic | 25–35 µm | 25–50 mm rolls | Reliable continuity across overlaps; conforms to curves. |
| Rough surfaces / texture | Conductive acrylic | 35–50 µm | 18–24 mm rolls | Thicker foil bridges texture; adhesive conducts through bondline. |
Conductive vs. Non-Conductive Copper Foil Tape
Both types use copper foil as the backing, but the main difference is whether electricity can pass through the adhesive layer.
| Feature | Conductive Copper Foil Tape | Non-Conductive Copper Foil Tape |
|---|---|---|
| Adhesive Type | Conductive acrylic adhesive | Standard acrylic adhesive |
| Through-Adhesive Conductivity | Yes | No |
| Electrical Continuity | Easier across bonded surfaces and overlaps | Requires direct copper-to-copper contact |
| EMI/RFI Shielding | Ideal for seams, enclosures and grounding paths | Suitable mainly for surface shielding |
| Typical Applications | Electronics, PCB grounding, cable shielding and enclosures | Crafts, decorative uses and general surface shielding |
| Cost | Slightly higher | More economical |
Key specs (CU25)
| Copper Foil Thickness | 25 µ ± 3 |
|---|---|
| Adhesive thickness | 35 µ ± 5 |
| Resistance value | ≈ 0.05 Ω |
| Heat resistance | 90–120 °C |
| Available widths | 2–390 mm • 50 m roll • 3″ core |
How To Install For Low Resistance (step-by-step)
- Prep the surface – Clean, dry, and lightly abrade paint/anodize if allowed. The goal is intimate contact and consistent pressure.
- Plan the path – Sketch the route from the noise source to ground; minimize sharp bends; choose overlap points.
- Lay with steady tension – Apply the tape smoothly; avoid wrinkles that can trap air and raise impedance.
- Create overlaps – Use 6–12 mm overlap on seams; burnish firmly with a roller to maximize contact.
- Tie into ground – Expose copper at the bond point; use hardware (e.g., screw + star washer) or solder where permitted.
- Verify continuity – Measure point-to-point resistance with a multimeter (mΩ target). Log values for QA.
- Stabilize – For high-vibration zones, add mechanical support (fasteners or strain relief) as needed.
Troubleshooting:
- High resistance at overlaps → Increase pressure, enlarge the overlap, or clean surfaces; confirm adhesive is conductive.
- Adhesive lift on texture → Step up to thicker foil, pre-roll with pressure, or consider a primer where compatible.
- Oxidation over time → Use treated surfaces/anti-oxidation grades, or seal edges with compatible coatings.
Compatibility and Limitations:
- Adhesive heat limits govern long-term performance; the copper backing itself handles higher temperatures.
- For outdoor/corrosive environments, consider protective topcoats or sealed assemblies.
- When mechanical robustness is mission-critical, use hardware bonds in addition to tape (belt-and-suspenders approach).
- If you only need high-temp masking (not conduction), select Green PET or Polyimide instead.
Engineering Case: EMI Shielding for Electronic Enclosures
An electronic equipment manufacturer needed to improve electrical continuity across metal enclosure seams and simplify the shielding installation process.
We recommended 25 μm conductive copper foil tape with conductive acrylic adhesive. Custom slit widths were produced to match the enclosure joints, while die-cut copper foil patches were supplied for grounding points and irregular areas.
Before production, samples were checked for adhesion, dimensional accuracy, through-adhesive conductivity, and continuity across overlapping seams.
The customized tape reduced manual cutting during assembly and provided reliable electrical contact across enclosure joints and grounding areas.
Solution supplied:
- 25 μm conductive copper foil tape
- Custom widths and roll lengths
- Die-cut grounding patches
- Adhesion and conductivity testing
FAQS
What Is Conductive Copper Foil Tape Used For?
Conductive copper foil tape is used for EMI/RFI shielding, electrical grounding, static discharge control, PCB repair, cable wrapping, electronic enclosures, and other applications requiring electrical continuity.
How Do You Use Conductive Copper Foil Tape?
Clean and dry the surface, apply the tape smoothly, and press it firmly with a roller. For shielding seams, overlap adjacent strips and verify electrical continuity after installation.
Can Copper Foil Tape Be Soldered?
Yes. The exposed copper surface can be soldered. Keep the soldering time short and control the heat to avoid damaging the adhesive layer.
What Is the Difference Between Conductive and Non-Conductive Copper Foil Tape?
Conductive adhesive allows electricity to pass through the adhesive layer, making it suitable for grounding and EMI shielding. Non-conductive adhesive provides mechanical bonding but requires direct copper contact for electrical continuity.
How Wide Should Copper Foil Tape Overlaps Be?
A 6–12 mm overlap is generally suitable for shielding seams. Firm pressure and clean surfaces help improve contact and reduce resistance.
Why Does Copper Foil Tape Resistance Increase Over Time?
Resistance may increase because of loose overlaps, oxidation, contamination, moisture, or insufficient pressure. Clean the contact area, reapply pressure, and consider anti-oxidation treatment for demanding environments.
